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HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

Brand Name: Customized
MOQ: 1 panel
Precio: Negociable
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certificación:
ISO9001,ISO13485, TS16949
Tipo de producto:
6 Capas de Hdi Pcb
Materia prima:
FR4/ROGERS/Aluminio/Alto TG/Medio TG
Puente de máscara de soldadura mínima:
0,08 mm
Espesor de cupia:
1oz
Pruebas:
Prueba de AOI
Máscara de soldadura:
Máscara de soldador negro
Control de impedancia:
± 10%
tecnología:
Agujeros ciegos y enterrados, taponamiento de resina.
Detalles de empaquetado:
Paquete de vacío
Resaltar:

HDI PCB with 1OZ copper

,

high-density interconnect PCB

,

HDI circuit board superior conductivity

Descripción de producto

Product Description:

 

About Blind hole and burid hole

When PCB space is constrained or plated through-hole design is limited, blind and buried vias can provide an effective solution.

Blind and buried via technology has been crucial for packing greater functionality into compact layouts. By shortening vias so they only traverse the necessary layers, more surface area is freed up for component placement.

These vias are employed to connect PCB layers where space is highly limited. A blind via links an outer layer to one or more inner layers without passing through the entire board. A buried via, on the other hand, connects two or more inner layers and does not reach any outer layer.

Key advantages include:

  • Meeting density requirements for traces and pads without adding layers or enlarging board size
  • Reducing the PCB aspect ratio

A blind via is a copper-plated hole that connects exactly one outer layer to one or more inner layers and does not penetrate the entire board. In design terms, blind vias are specified in a separate drill file.HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity 0