logo
GT SMART (Changsha) Technology Co., Limited
Correo electrónico alice@gtpcb.com TELéFONO 86-153-8898-3110
Hogar > productos > PWB pesado del cobre >
10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology
  • 10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology

10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology

Certificación ISO9001, TS16949
Detalles del producto
Artículo:
Placa de circuito personalizado 10 capa
Cobre gruesas:
1 oz para cada capa
Espesor de la tabla:
FR4 TG150 1,6 mm
Servicio PCBA:
El conjunto de componentes SMD SMT DIP
Tecnología:
Control de impendas, dedo más grande+ bisel
Línea mínima espacio:
3 milímetros (0,075 mm)
Tamaño mínimo de agujeros:
0.2 mm
Tamaño de agujero mínimo:
0.2 mm
Pago y términos de envío
Cantidad de orden mínima
1 panel
Precio
Negociable
Detalles de empaquetado
Paquete de vacío
Tiempo de entrega
1-2 semanas
Condiciones de pago
T/T
Descripción de producto

Product Description:

A 10-layer, 1 oz rigid PCB is a high-performance circuit board with 10 conductive copper layers and a standard copper thickness of 1 ounce on each layer. This type of board is used in advanced electronics where high density, reliability, and signal integrity are essential.

The term "10-layer" refers to the number of conductive copper layers. These layers are stacked and separated by insulating materials (dielectrics) like FR-4 (fiberglass-epoxy laminate). The stack-up of these layers is carefully designed to optimize performance. A typical configuration might include: 
Signal Layers: These layers carry data and signals between components. With 10 layers, designers have ample space to route complex circuits, reducing signal congestion and allowing for high-density component placement.
Power and Ground Planes: Dedicated layers for power and ground provide a stable and low-impedance path for current, which is crucial for high-speed digital circuits. They also act as a shield to minimize electromagnetic interference (EMI) and help with heat dissipation.


Technical Parameters:

Product item 10 layer rigid PCB board
Board Thickness FR4 Tg150 1.6mm 
Processing Technology Impendace control, golden finger
Solder Mask Color Geen soldermask+ white silkscreen
Standard Testing IPC Class 2
Minimum Hole Size 0.2mm
Pcba Service SMD SMT DIP Component Assembly
Minimum Line Space 3mil (0.075mm)
Min Hole Size 0.2MM



Support and Services:

Our Product Technical Support and Services for the Heavy Copper PCB include:

- Expert consultation on design and manufacturing considerations

- Assistance with material selection and specifications

- Guidance on meeting industry standards and regulations

- Troubleshooting and resolution of technical issues

- Customization options to meet specific requirements

Éntrenos en contacto con en cualquier momento

86-153-8898-3110
Sala 401,Edificio No.5, Parque Tecnológico Dingfeng, Comunidad Shayi, Ciudad Shajing, Distrito Bao'an, Shenzhen, Provincia Guangdong, China
Envíenos su investigación directamente